Systems, devices, and methods for using a real time environment sensor in a FOUP

ABSTRACT

The present disclosure provides systems and methods for monitoring an environment of a front opening universal pod (FOUP). The systems and methods may include one or more environmental sensors disposed within the FOUP, configured to measure environmental parameters of the environment of the FOUP and a FOUP configured to hold one or more wafers. The systems and methods may also include a wireless transmitter in communication with the environmental sensor, which may be disposed within the FOUP and configured to transmit the measured environmental parameters from the environmental sensor.

CROSS REFERENCE

The present application claims benefit of U.S. Ser. No. 62/585,762 filedNov. 14, 2017, which is hereby incorporated by reference in itsentirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component or line that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs. Such scaling down has also increased the complexity ofprocessing and manufacturing ICs and, for these advances to be realized,similar developments in IC processing and manufacturing are needed.

As one example, semiconductor lithography processes may includeprocessing semiconductors wafers using lithographic templates (e.g.,photomasks or reticles) to optically transfer patterns onto a substrate.Such a process may be accomplished, for example, by projection of aradiation source, through an intervening photomask or reticle, onto aphotosensitive material (e.g., photoresist) coating on the wafer. Theminimum feature size that may be patterned by way of such a lithographyprocess is limited by the wavelength of the projected radiation source.In view of this, precise lithographic processes have been introduced,including radiation sources such as extreme ultraviolet (EUV) radiationsources. However, these precise processes may cause the wafers to bevery sensitive to contamination issues. For example, particlecontamination introduced onto a wafer can result in significantdegradation of lithographically transferred patterns. The particlecontamination may occur during handling and transportation of wafers.Furthermore, the wafers may be sensitive to changes in temperature,humidity, and other environmental factor.

To avoid this contamination, wafers may be placed in a Front OpeningUnified Pod (FOUP) for transportation and holding between processes.FOUPs generally include a specialized enclosure designed to provide acontrolled environment for the wafers. However, existing transportationand handling processes do not provide for measurement of the environmentof the FOUPs during or between processing stages (“inline”) and insteadonly measure environmental factors when FOUPs are taken out ofprocessing (“offline”). This may allow unaddressed environmentalproblems, which in turn, may damage wafers. Thus, existing environmentalsystems for FOUPs have not proved entirely satisfactory in all respects.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale. The dimensions of the various featuresmay be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a diagram of a system for monitoring a FOUP in accordance withaspects of the present disclosure.

FIG. 2 is a diagram of a FOUP with one or more environmental sensors inaccordance with aspects of the present disclosure.

FIG. 3 is another diagram of a FOUP with one or more environmentalsensors in accordance with aspects of the present disclosure.

FIG. 4 is a diagram of a process of monitoring a FOUP in accordance withaspects of the present disclosure.

FIG. 5 is a flow diagram of a method for monitoring a FOUP in accordancewith aspects of the present disclosure.

DETAILED DESCRIPTION

The present disclosure relates to monitoring the environment of a FOUP.While the present disclosure is described in terms of monitoring a FOUP,it will be appreciated that the any device used for transporting orhandling sensitive devices can benefit from the present invention.

It is understood that the following disclosure provides many differentembodiments or examples for implementing different features of theinvention. Specific examples of components and arrangements aredescribed below to simplify the present disclosure. These are merelyexamples and are not intended to be limiting. Some items are shown in asimplified form and inherently include components that are well known inthe art. In addition, the present disclosure may repeat referencenumerals and/or letters in the various examples. This repetition is forthe purpose of simplicity and clarity and does not in itself dictate arelationship between the various embodiments and/or configurationsdiscussed.

Referring to FIG. 1, a diagram of a monitoring system 100 is shown. Themonitoring system 100 may include a FOUP 102, a processing stage 120, acontroller 130, and a display device 140. In some embodiments, the FOUP102 may include one or more environmental sensors 110 and a transmitter114. The one or more environmental sensors 110 may be disposed withinthe FOUP 102 (such as on a door 222 of the FOUP 102 as shown in FIG. 3).In some embodiments, the one or more environmental sensors 110 areconfigured to measure environmental parameters of the interiorenvironment of the FOUP. In particular, the one or more environmentalsensor 110 may provide real time measurements of environmentalparameters of the FOUP. These measurements may be stored in one or morememory devices such as memory 118, which may be disposed in the FOUP102. The transmitter 114 may be a wireless transmitter, and may beconfigured to transmit the measured environmental parameters to thecontroller 130.

In some embodiments, real time monitoring of the FOUP 102 may preventharm to wafers stored within the FOUP 102. In some cases, wafers arestored within a FOUP 102 for more than twice as much time as they arewithin processing stages. Existing systems may not be able to identifyenvironmental problems between stages, which may increase the risk ofdamage to wafers. Therefore, the quick identification and remedy ofenvironmental problems as provided by the embodiments presented hereincan avoid serious damage to wafers.

In other embodiments, the one or more environmental sensors 110 areconfigured to measure environmental parameters of the FOUP 102 atparticular times. For example, the one or more environmental sensors 110may be configured to measure environmental parameters of the FOUP 102before and after a particular process stage 120. This may help to reducethe amount of power consumed by the environmental sensors 110.

The controller 130 may include a processor 132, a memory 134, atransmitter 136, and a receiver 138. In some embodiments, the controller130 is configured to collect and analyze measured environmentalparameters from the environmental sensor 110 and determine if theenvironmental parameters are within acceptable limits. The controller130 may also be configured to send instructions to the FOUP 102, theprocess stage 120, or other devices if the measured environmentalparameters are not within acceptable limits. For example, if the one ormore environmental sensors 110 sends measurements to the controller 130that show that environmental parameters are above safe operating limits,the controller 130 may send instructions to remove the FOUP 102 fromprocessing and remedy the problem.

The processor 132 of the controller 130 may include any one or more of amicroprocessor, a controller, a digital signal processor (DSP), anapplication specific integrated circuit (ASIC), a field-programmablegate array (FPGA), or equivalent discrete or integrated logic circuitry.In some embodiments, the controller 130 is a computer system. Theprocessor 132 may be connected to the memory 134, transmitter 136, andreceiver 138. In some embodiments, the processor 132 is connected to adisplay device 140 (such as a monitor or other type of screen) forviewing environmental measurements, alerts, and instructions. Thedisplay device 140 may be used to display the status of the FOUP,environmental alerts, or other information relevant to the FOUP.

In some embodiments, the controller 130 is configured to transmit analert to one or more operators identifying a FOUP 102 with anenvironmental problem as well as the type of environmental problem thathas been identified (i.e., “particles” for particle contamination).These alerts may be displayed on the display device 140. The displaydevice 140 may be a computer monitor or other type of screen that may beviewed by an operator. The display device 140 may be configured todisplay a visual alert 142. For example, in the example of FIG. 1, thedisplay device 140 shows a simple “ALERT” message. The color of thevisual alert 142 may include colors, shapes, icons, blinking patterns,etc., to indicate that a problem exists with a FOUP 102. In someembodiments, the colors of the visual alert 142 may correspond withproblems that are identified. For example, the visual alert 142 maydisplay a red alert if the temperature is found to be above acceptablelimits, a yellow color if particulate levels are found to be higher thannormal, etc. In other embodiments, a single color (such as red) is usedfor all visual alerts.

Other messages 144 may also be displayed on the display device 140.These other messages 144 may include a particular number oridentification data of a FOUP 102, as well as the problem that has beenidentified. For example, in the example of FIG. 1, the temperature ofthe FOUP 102 was measured by the one or more environmental sensors 110and determined to be above acceptable levels by the controller 130.Thus, the message 144 lists “temp” as the problem. Other problems thatmay be identified by the other messages 144 include humidity that ishigher or lower than normal, temperature that is higher or lower thannormal, vibration levels that are higher than normal, incident radiationlevels that are higher than normal, particle amounts that are higherthan normal, and problems with the chemical composition within the FOUP102 (such as amounts of other gases besides nitrogen being measured).The display of the visual alert 142 and other messages 144 may allow anoperator to quickly identify an environmental problem and the particularFOUP 102 with the problem. This may help to remedy the problem quicklyand minimize harm to the wafers within the FOUP 102.

The controller 130 may also transmit instructions to the FOUP 102 itselfto indicate an environmental problem. In one embodiment, the FOUP 102includes an indicator 228 such as a light or screen that is configuredto display a certain color or blinking pattern if environmental problemsare found. For example, if the one or more environmental sensors 110detect humidity levels that are higher than acceptable levels, the FOUP102 may display a blinking red light. The indicator 228 may be placed onthe enclosure 220 of the FOUP 102 or the door 222 of the FOUP 102 (asshown in FIG. 3). The type, shape, and display of the indicator mayvary. For example, in one embodiment, the indicator 228 is a small LEDlight that is configured to display a red or green light depending onthe status of the FOUP 102. In another embodiment, the indicator 228 isa screen disposed on the exterior of the FOUP 102 and configured todisplay real time measurements of the environmental parameters asmeasured by the one or more environmental sensors 110. The use of thedisplay device 140 as well as the indicator 228 may help operators toquickly identify and remedy problems with the FOUP 102 and thus avoiddamage to wafers.

The memory 134 of the controller 130 may be a semiconductor memory suchas, for example, read-only memory, a random access memory, a FRAM, or aNAND flash memory. The memory 134 may interface with the processor 132and associated processors such that the processor 132 may write to andread from the memory 134. In some embodiments, the memory 134 may beconfigured to store the environmental measurements from the one or moreenvironmental sensors 110. The memory 134 may also be configured tostore previous readings from the environmental sensors 110 as well asthreshold values for each environmental parameter. In this case, thecontroller 130 may compare the environmental measurements to thethresholds to determine if the environment within the FOUP 102 is withinsafe operating conditions. If this is not the case, the controller 130may issue an alert to an operator and/or a process stage 120 so that theenvironmental problem can be corrected.

In some embodiments, the memory 134 of the controller 130 is configuredto store the environmental parameters measured by the one or moreenvironmental sensors 110. For example, the environmental parameters fora particular FOUP 102 may be stored during an entire operation,including before and after all processing stages. This may allow anoperator to determine when environmental problems arise duringprocessing stages, such as identifying areas within a fabrication areawhere temperature or humidity is higher than normal. In one embodiment,the memory 134 may be configured to store environmental parameters froma number of FOUPs. These parameters may be compared to determine trendsin FOUP environments. The storing and comparison of environmentalparameters may also help to identify problematic FOUPs to avoidcontinuing damage to wafers.

The receiver 138 of the controller 130 may be configured to receivetransmissions from the transmitter 114 of the FOUP 102. The memory 134of the controller 130 may be configured to store measurements andinstructions. The transmitter 136 of the controller 130 may beconfigured to send instructions to the FOUP 102, the process stage 120,or other locations.

The FOUP 102 may be placed in the process stage 120 during a processingoperation for the wafers within the FOUP. In some embodiments theprocess stage 120 may be configured to receive instructions from thecontroller 130. For example, if the controller 130 determines that theone or more environmental parameters of the FOUP 102 are not withinacceptable limits, the controller 130 may transmit directions to theFOUP 102 and/or the process stage 120 to remove the FOUP 102 fromprocessing. The process stage 120 may also include a processor and/or areceiver.

FIG. 2 is a diagram of a FOUP 102 with one or more environmental sensors110. In some embodiments, the FOUP 102 includes an enclosure 220configured to hold one or more wafers 212 in a protected environment.The wafers 212 may be carried on a retaining feature 216. The retainingfeature 216 may be a rack, bracket, shelf, clip, framework, or otherfeature to secure the wafers 212 during transport and handling. Theenclosure 220 may have a generally rectangular shape with a bodyincluding three connected walls, a door 222 (shown in FIG. 3), a top226, and a base 214. In some embodiments, the enclosure 220 has curvedupper corners. The enclosure 220 may be made of a rigid material toprotect and securely hold the wafers inside. In some embodiments, theenclosure is formed from plastic materials. In some embodiments, aflange 210 is disposed on a top surface of the top 226 of the FOUP 102.One or more handles 218 may be disposed on sides of the enclosure 220.In some embodiments, the flange 210 and handles 218 may be used tohandle and transport the FOUP 102.

The FOUP 102 may be configured to support a controlled environment.Aspects or parameters of this controlled environment may include, forexample, humidity, temperature, vibration, incident radiation, particledensity, and chemical composition. The controlled environment may becreated by one or more environmental support devices 112 in the FOUP102. These environmental support devices 112 may include vents andpurging systems (which may be disposed on the walls, base 214, top 226,and door 222 of the FOUP 102), mechanical structures such asanti-radiation plating and coatings, anti-vibration systems, gaskets,flanges, and other sealing features (which may be disposed in the walls,door 222, and base 214 of the FOUP 102), gas systems such as humiditycontrol devices, input/output valves, and electronics to support theenvironmental support devices 112. For example, the FOUP 102 may includea primarily nitrogen gas environment which may help to avoid nativeoxide growth on the wafers as well as organic contaminants. In someembodiments, the FOUP 102 is configured to maintain a particle freenitrogen environment with a constant temperature, humidity, and minimalincident radiation and vibration. In some embodiments, the one or moreenvironmental sensors 110 are connected to the one or more environmentalsupport devices 112.

One or more environmental sensors 110 may be placed on or within theFOUP to assist in maintain the environment of the FOUP 102. The one ormore environmental sensors 110 may be disposed within an interior volumeof the FOUP 102 and may measure the environmental parameters of the FOUP102 including humidity, temperature, vibration, incident radiation,particle density, and chemical composition. The environmental sensors110 may include one or more humidity sensors, thermometers,accelerometers, radiation detectors, particle detectors, and chemicaldetection systems. In some embodiments, two or more environmentalsensors 110 of the same type may be included in the FOUP 102. Forexample, the FOUP 102 may include two temperature sensors and/or twovibration sensors. The inclusion of more than one sensor of each typemay help to verify readings and provide a level of security in case oneof the sensors fails. In some embodiments, the environmental sensors 110are disposed on a door 222 of the FOUP 102 as shown in FIG. 3. In otherembodiments, the environmental sensors 110 are disposed on otherportions of the FOUP 102, such as on the walls, base 214, or top 226.The one or more environmental sensors 110 may be configured to takemeasurements of the environment within the FOUP 102 in real time,including during handling and transportation. This may provide an earlywarning for FOUP control systems and may help to remedy problems beforewafers 212 are harmed. In some embodiments, the one or moreenvironmental sensors 110 include sensors of two or more types. Forexample, the FOUP 102 may include a vibration sensor integrated into afirst portion of the door 222 of the FOUP 102 and a humidity sensorintegrated into a second portion of the door 222 of the FOUP 102. Insome embodiments, the one or more environmental sensors 110 areconfigured to take measurements of the FOUP environment between everyprocess stage 120. In other embodiments, the one or more environmentalsensors 110 are activated during and after particular process stages,such as after a lithographic stage. The one or more environmentalsensors 110 may be activated automatically by the controller 130 orother computer system, or manually by an operator. In some embodiments,the one or more environmental sensors 110 are configured to be activatedby a port or switch on an external surface of the FOUP 102, such thatthe environmental sensors 110 may be activated by a person or machinehandling the FOUP 102.

The one or more environmental sensors 110 may be configured to controlthe environmental support devices 112 to control the environment withinthe FOUP 102. This may include adjusting the pressure, humidity,temperature, and/or chemical composition of the FOUP 102. For example,the one or more environmental sensors 110 may identify the presence ofcontaminants in the nitrogen gas within the FOUP 102. In response, apurging system may automatically activate within the FOUP 102 to flushout the contaminants. This may allow the FOUP 102 to correct someenvironmental problems automatically while the FOUP is on the productionline and without requiring the FOUP 102 to be moved offline.Additionally, automatic systems within the FOUP 102 may allow problemsto be remedies quickly to avoid damage to wafers.

The one or more environmental sensors 110 may include a processor 116and a memory 118. For example, the processor 116 of the environmentalsensors 110 may include any one or more of a microprocessor, acontroller, a digital signal processor (DSP), an application specificintegrated circuit (ASIC), a field-programmable gate array (FPGA), orequivalent discrete or integrated logic circuitry. The processor 116 maybe connected to the memory 118 as well as a transmitter 114. In someembodiments, the processor 116 may be configured to receive measurementsfrom the one or more environmental sensors 110 and transmit themeasurements via the transmitter 114. The memory 118 of theenvironmental sensors 110 may be a semiconductor memory such as, forexample, read-only memory, a random access memory, a FRAM, or a NANDflash memory. The memory 118 may interface with the processor 116 suchthat the processor 116 may write to and read from the memory 118. Theone or more environmental sensors 110 may be powered through a powersource disposed within the FOUP 102. For example, the one or moreenvironmental sensors 110 may be powered by one or more batteries storedwithin the FOUP. These batteries may be recharged at environmentalremedy stations, such as environmental remedy station 410 as shown inFIG. 4.

The transmitter 114 may be configured to receive measurements from theone or more environmental sensors 110 and transmit the measurements tothe controller 130, a process stage 120, and/or other locations. In someembodiments, the transmitter 114 is a wireless transmitter. Thetransmitter 114 may be disposed inside the FOUP 102, such as attached adoor 222 of the FOUP 102. In some embodiments, the transmitter 114 ispositioned together with the one or more environmental sensors 110within a housing. The transmitter 114 may also be integrated into thedoor 222 of the FOUP 102 with the one or more environmental sensors 110.The transmitter 114 may be electrically connected with the one or moreenvironmental sensors 110.

FIG. 3 is a diagram showing a side view of the FOUP 102. In someembodiments, the FOUP 102 includes a door 222 that is configured toconnect to the enclosure 220 of the FOUP 102. The door 222 may beremovable. The one or more environmental sensors 110 may be disposed onan interior surface of the door 222. In some embodiments, thetransmitter 114 is also disposed on the interior surface of the door222. The one or more environmental sensors 110 and/or transmitter 114may be disposed within a housing 224 on the door to protect theenvironmental sensors 110 and/or transmitter from being damaged duringloading and unloading the FOUP 102. In some embodiments, the housing 224is removable so that an operator can access the environmental sensors110 and/or transmitter 114. In some embodiments, the one or moreenvironmental sensors 110 are integrated into the door 222 of the FOUP102, such that portions of the door 222 extend around the one or moreenvironmental sensors 110. In other embodiments, the one or moreenvironmental sensors 110 are disposed in a housing that is attached tothe door 222. This housing may conform to the shape of the one or moreenvironmental sensors 110. The housing may help to protect the one ormore environmental sensors from being damaged during processing.

FIG. 4 is a diagram 400 showing a process of monitoring a FOUP 102. Asdiscussed above, the FOUP 102 may include one or more environmentalsensors 110 which may perform measurements of the internal environmentof the FOUP 102. In some embodiments, the one or more environmentalsensors 110 are configured to measure the environment of the FOUP 102 inreal time and transmit these measurements in real time to the controller130. A number of process stages 402, 404, 406 are also shown on in thediagram 400. The one or more environmental sensors 110 may be configuredto measure the environment of the FOUP 102 between stages 402 and 404and between stages 404 and 406. In some embodiments, the one or moreenvironmental sensors 110 are configured to measure the environmentalparameters of the FOUP 102 before and/or after a particular processstage 402, 404, 406.

In some embodiments, the controller 130 is configured to receive themeasurements of the one or more environmental sensors 110 and determineif the measurements are within acceptable ranges. If the controller 130determines that the measurements are within acceptable ranges, the FOUP102 is allowed to continue to the next stage 404, 406. If the controller130 determines that the measurements are outside acceptable ranges, thecontroller 130 may issue a prompt or alert to an operator and the FOUP102 may be removed from the process stages 402, 404, 406 and movedoffline. This may involve physically removing the FOUP 102 from theprocessing stage 402, 404, 406 and/or taking the FOUP 102 an environmentremedy station 410. In the environment remedy station 410, anydeficiencies in the environment of the FOUP 102 (such as thoseidentified by the one or more environmental sensors 110) may beremedied. This may involve removing dust or other particulates, purgingthe FOUP 102, renewing the gas within the FOUP 102 (such as rechargingnitrogen levels), changing the humidity of the FOUP 102, changing thetemperature of the FOUP 102, as well as taking other steps to remedyproblems with the environment of the FOUP 102. Once the remedies arecomplete, the environmental parameters of the FOUP 102 may be recheckedby the one or more environmental sensors 110 to ensure that the problemhas been remedied. After the environment of the FOUP 102 is determinedto be within acceptable levels, the FOUP 102 may be returned to theprocessing stages 402, 404, 406. In some embodiments, the FOUP 102 maybe returned to its location before the environmental problem wasdetected. For example, the one or more environmental sensors 110 withina FOUP 102 may measure an abnormally high temperature shortly before theFOUP 102 is scheduled for process stage 404. After the FOUP 102 ispulled offline and the problem is remedied, the FOUP 102 may be returnedto process stage 404. In some embodiments, if damage to the wafers inthe FOUP 102 is detected, the wafers of the FOUP 102 may be discardedand the FOUP 102 may be returned to the beginning of the operation tohold a new set of wafers.

FIG. 5 is a flow diagram of a method 500 for monitoring a FOUP inaccordance with aspects of the present disclosure. It is understood thatadditional steps can be provided before, during, and after the steps ofmethod 500, and that some of the steps described can be replaced oreliminated for other implementations of the method 500.

In one embodiment, the method 500 begins at step 502 with providing anenvironmental sensor and a transmitter in a front opening universal pod(FOUP). The environmental sensor, transmitter, and FOUP may be theenvironmental sensor 110, transmitter 114, and FOUP 102 as shown in anyof FIGS. 1-4. The environmental sensor and transmitter may be disposedwithin the FOUP, such as on the door of the FOUP. The environmentalsensor may be configured to measure environmental parameters of theFOUP, such as humidity, temperature, vibration, incident radiation,particle density, and chemical composition. The transmitter may beconfigured to transmit the measured environmental parameters to acontroller, such as controller 130 as shown in FIG. 1.

At step 504, the method 500 may include determining threshold levels forthe one or more environmental parameters. In some embodiments, thethreshold levels may represent limits above which wafers within the FOUPmay be damaged. For example, threshold levels for pressure may be 1.2atm or 0.8 atm (with an ideal pressure of 1 atm). Another example is athreshold level of 5% or 65% relative humidity (with an ideal relativehumidity of 40%). The threshold levels may be determined by orcommunicated to a controller within the FOUP and may be stored in amemory within the FOUP or in an external controller.

At step 506, the method 500 may include measuring one or moreenvironmental parameters with the environmental sensor. Theenvironmental sensor may include humidity sensors, thermometers,accelerometers, radiation detectors, particle detectors, and chemicaldetection systems. In some embodiments, the environmental sensor is usedto measure the environmental parameters is real time. Alternatively, theenvironmental sensor may measure the environmental parameters at certaintimes during transportation, handling, and processing of the FOUP, suchas between processing stages. The measurements may be stored in memorywithin the FOUP.

At step 508, the method 500 may include transmitting the one or moreenvironmental parameters to a controller. In some embodiments, thetransmission is wireless and is accomplished with a wirelesstransmitter. The controller may include a wireless receiver and maystore the received measurements.

At step 510, the method 500 may include determining whether the one ormore environmental parameters are within the threshold levels determinedin step 504. This may include comparing, with the controller, themeasured environmental parameters to the threshold levels. Step 510 mayalso include displaying the determination, such as with a graphic oralert, on a display device. This display device may be similar to thedisplay device 140 as shown in FIG. 1. Additionally and alternatively, adisplay feature may be included on the FOUP to display thisdetermination. This display feature may be similar to the indicator 228as shown in FIGS. 2 and 3. If the controller determines that the one ormore measured environmental parameters are within the threshold levels,the FOUP may be transferred to a process stage at step 516. The FOUP mayalso be configured to display a message, graphic, or other indicia ofthe determination (such as a green light). If the controller determinesthat the one or more measured environmental parameters are not withinthe threshold levels, the method 500 may proceed to step 512. The FOUPmay also be configured to display a message, graphic, or other indiciaof the determination (such as a red light). An alert may also betransmitted to a process stage. This alert may be displayed on a displaydevice located nearby or disposed on the process stage. For example, acontroller may determine that a FOUP has an environmental problem basedon readings from the one or more environmental sensors within the FOUP.As the FOUP is transported to the process stage for processing, theprocess stage may display an indication of a problem with the particularFOUP. This may help an operator to identify problems with the FOUPbefore processing and may help to remedy the environment as soon aspossible to avoid damage to wafers in the FOUP.

At step 512, the method 500 may include conducting an operation tocorrect the one or more environmental parameters. This may includetaking the FOUP offline and to a particular area for addressing the FOUPenvironment. In some embodiments, this step 512 includes rechargingnitrogen (or other gases) within the FOUP, flushing out gases from theFOUP, removing particles, reducing or increasing humidity or temperaturelevels, and/or replacing mechanisms on the FOUP such as faulty seals.

At step 514, the method 500 may optionally include determining if theone or more environmental parameters are within the threshold levelsafter conducting the operation of step 512. This may help to ensure thatall problems are fixed and the FOUP is ready for further transportationand handling.

At step 516, the method 500 may include transferring the FOUP to aprocess stage. This process stage may be any of the process stages 120,402, 404, 406 as shown in FIGS. 1 and 4.

In an exemplary implementation within the scope of the presentdisclosure, the method 500 repeats after step 516, such that method flowgoes back to step 504 and begins again. Iteration of the method 500 maybe utilized to carry out ongoing monitoring of the environment within aFOUP.

Thus, the present disclosure provides a system for monitoring a frontopening universal pod (FOUP). In one embodiment, the system includes aFOUP configured to hold one or more wafers and an environmental sensordisposed within the FOUP and configured to measure one or moreenvironmental parameters of an interior environment of the FOUP. Thesensor system may also include a wireless transmitter in communicationwith the environmental sensor, the wireless transmitter disposed withinthe FOUP. In some embodiments, the wireless transmitter is configured toreceive the one or more measured environmental parameters from theenvironmental sensor.

In some embodiments, the environmental sensor is disposed on a door ofthe FOUP. The wireless transmitter may also be disposed on a door of theFOUP. In some embodiments, the environmental sensor is configured tomeasure in real time the one or more environmental parameters of theinterior environment of the FOUP. The one or more environmentalparameters may include humidity, temperature, vibration, incidentradiation, particle density, and chemical composition.

In some embodiments, the system also includes a memory in communicationwith the environmental sensor and the wireless transmitter. This memorymay be configured to store one or more threshold values associated withthe one or more environmental parameters. The environmental sensor mayalso include a memory module configured to store measurements of the oneor more environmental parameters of the interior environment of theFOUP.

The present disclosure may also provide for a system for monitoring aFOUP. This system may include a FOUP configured to hold one or morewafers, an environmental sensor disposed within the FOUP and configuredto measure one or more environmental parameters of an interiorenvironment of the FOUP, a wireless transmitter in communication withthe environmental sensor, the wireless transmitter disposed within theFOUP, wherein the wireless transmitter is configured to receive the oneor more measured environmental parameters from the environmental sensorand transmit the one or more measured environmental parameters, and acontroller configured to receive the transmitted one or more measuredenvironmental parameters from the wireless transmitter and determinewhether the one or more environmental parameters fall within safetythreshold levels.

In some embodiments, the controller is configured to send instructionsto send the FOUP to a process stage if the measured one or moreenvironmental parameters fall within the safety threshold levels. Thiscontroller may include a memory configured to store the safety thresholdlevels and to compare the stored safety threshold levels to the measuredone or more environmental parameters. In some embodiments, theenvironmental sensor and the wireless transmitter are disposed on a doorof the FOUP. The environmental sensor may be configured to measure inreal time the one or more environmental parameters of the interiorenvironment of the FOUP. These one or more environmental parameters mayinclude humidity, temperature, vibration, incident radiation, particledensity, and chemical composition.

The present disclosure also provides a method for monitoring anenvironment within a front opening universal pod (FOUP). This method mayinclude the steps of providing an environmental sensor within the FOUP,measuring one or more environmental parameters of the FOUP with theenvironmental sensor, determining, with a controller, threshold levelsfor the one or more environmental parameters of the FOUP, transmitting,with a wireless transmitter disposed within the FOUP, the measured oneor more environmental parameters of the FOUP to the controller,determining whether the measured one or more environmental parameters ofthe FOUP are within the threshold levels, and transferring the FOUP to aprocess stage if the measured one or more environmental parameters aredetermined to be within the threshold levels.

In some embodiments, the method also includes conducting an operation tocorrect the one or more environmental parameters if the measured one ormore environmental parameters are determined to not be within thethreshold levels. The method may also include transferring the FOUP tothe process stage after conducting the operation. The method may alsoinclude measuring the one or more environmental parameters of the FOUPwith the environmental sensor in real time. In some embodiments, themethod further includes transmitting, with the wireless transmitterdisposed within the FOUP, the measured one or more environmentalparameters of the FOUP to the controller in real time. The one or moreenvironmental parameters may include humidity, temperature, vibration,incident radiation, particle density, and chemical composition.

Features of several embodiments have been outlined above. Those skilledin the art will appreciate that they may readily use the presentdisclosure as a basis for designing or modifying other processes andstructures for carrying out the same purposes and/or achieving the sameadvantages as the embodiments introduced above. Those skilled in the artwill also realize that such equivalent constructions do not depart fromthe spirit and scope of the present disclosure, and that they may makevarious changes, substitutions and alterations to the disclosedembodiments without departing from the spirit and scope of the presentdisclosure.

What is claimed is:
 1. A system, comprising: a front opening universalpod (FOUP) configured to hold one or more wafers; an environmentalsensor disposed within the FOUP and configured to measure one or moreenvironmental parameters of an interior environment of the FOUP; awireless transmitter in communication with the environmental sensor, thewireless transmitter disposed within the FOUP, wherein the wirelesstransmitter is configured to wirelessly transmit the one or moreenvironmental parameters from the environmental sensor to a controllerdisposed outside of the FOUP to decide whether the one or moreenvironmental parameters are within threshold limits and receive amessage according to a decision of whether the one or more environmentalparameters are within the threshold limits from the controller; and anindicator disposed on the FOUP and configured to display an indicationof the interior environment of the FOUP according to the message.
 2. Thesystem of claim 1, wherein the environmental sensor is disposed on adoor of the FOUP.
 3. The system of claim 1, wherein the wirelesstransmitter is disposed on a door of the FOUP.
 4. The system of claim 1,wherein the environmental sensor is configured to measure in real timethe one or more environmental parameters of the interior environment ofthe FOUP.
 5. The system of claim 1, wherein the one or moreenvironmental parameters comprise humidity, temperature, vibration,incident radiation, particle density, and chemical composition.
 6. Thesystem of claim 1, wherein the indicator is an LED light configured todisplay an alert if the one or more environmental parameters exceed thethreshold limits.
 7. The system of claim 1, wherein the indicator is ascreen configured to display the one or more environmental parameters.8. The system of claim 1, wherein the environmental sensor comprises amemory module configured to of the one or more environmental parametersof the interior environment of the FOUP.
 9. A system, comprising: afront opening universal pod (FOUP) configured to hold one or morewafers; an environmental sensor disposed within the FOUP and configuredto measure one or more environmental parameters of an interiorenvironment of the FOUP; a wireless transmitter in communication withthe environmental sensor, the wireless transmitter disposed within theFOUP, wherein the wireless transmitter is configured to receive the oneor more environmental parameters from the environmental sensor andwirelessly transmit the one or more environmental parameters to acontroller outside of the FOUP to decide whether the one or moreenvironmental parameters are within threshold limits and receive amessage according to a decision of whether the one or more environmentalparameters are within the threshold limits from the controller; and anenvironmental support device disposed in the FOUP and configured tochange the interior environment of the FOUP if the one or moreenvironmental parameters exceed the threshold limits.
 10. The system ofclaim 9, wherein the environmental sensor is operable to be activatedautomatically before or after a process stage.
 11. The system of claim9, wherein the environmental sensor includes more than one sensors formeasuring a same type of environmental parameter.
 12. The system ofclaim 9, wherein the environmental sensor and the wireless transmitterare disposed on a door of the FOUP.
 13. The system of claim 9, whereinthe environmental sensor is configured to measure in real time the oneor more environmental parameters of the interior environment of theFOUP.
 14. The system of claim 9, wherein the environmental supportdevice includes at least one of a purging system, an anti-radiationsystem, an anti-vibration system, a sealing system, a humidity controlsystem, and an input/output valve.
 15. A method for monitoring anenvironment within a front opening universal pod (FOUP), comprising:measuring one or more environmental parameters of the FOUP with anenvironmental sensor disposed within the FOUP; transmitting, with awireless transmitter disposed within the FOUP, the one or moreenvironmental parameters of the FOUP to a controller outside of theFOUP; and receiving, with the wireless transmitter from the controller,a message according to a decision of whether the one or moreenvironmental parameters of the FOUP are within the threshold levels.16. The method of claim 15, further comprising conducting, by anenvironmental support device in the FOUP, an operation to change theenvironment within the FOUP if the one or more environmental parametersare determined to not be within the threshold levels.
 17. The method ofclaim 16, wherein the operation includes at least one of purging,sealing, renewing gas, reducing radiation, reducing vibration, changinghumidity, and changing temperature of the FOUP.
 18. The method of claim15, further comprising measuring the one or more environmentalparameters of the FOUP with the environmental sensor in real time. 19.The method of claim 15, further comprising indicating an alert, by anindicator disposed on the FOUP, if the one or more environmentalparameters are determined to not be within the threshold levels.
 20. Themethod of claim 15, further comprising displaying the one or moreenvironmental parameters by a screen disposed on the FOUP.